Ultrasonic-heat cleaning module evaluation held

On July 20th, Microsystems held its first evaluation of the ultrasonic-heat cleaning module with the participation of executives and employees.

At this fair, we directly demonstrated the ultrasonic cleaning module under development and inspected its cleaning performance, operating convenience, and product completeness.

We also shared various field opinions and discussed directions for future performance improvement and product advancement.

Microsystem will further increase the reliability and practicality of its products based on the valuable opinions collected at this fair.

Additionally, we will create cleaner and more convenient cleaning solutions through continuous technological innovation.